PUBLICATIONS

Scientific Reports

Oxide semiconductors and related devices produced by high power impulse magnetron sputtering and selective area atomic layer deposition methods

Christy Fadel1, Stéphane Cuynet1, Claudia De Melo1, Marcos Soldera2,
Jean-François Pierson1, Frank Müklich3, David Horwat1

1. Institut Jean lamour, Nancy, France / 2. Institut für Fertigungstechnik, Dresden,Germany / 3. Lehrstuhl für Funktionswerkstoffe, Saarbrücken, Germany

Abstract

Zinc oxide (ZnO) and Al-doped ZnO (AZO) are widely used as n-type
semiconductors and transparent electrodes due to the abundance and low cost of Zn and Al in addition to their high optical and electrical properties. An important technique for depositing (AZO) films is the High Impulse Magnetron
Sputtering (HiPIMS) method that allows us to deposit highly conductive and transparent films on large surfaces and at low temperatures [1]. Another
important technique is the Atomic Layer Deposition (ALD) which is used for depositing high-quality films with excellent surface coverage on high aspect
ratio structures; this method enables us to combine metallic Cu films with semiconductor oxides (ZnO, Cu2O, or both) leading to many applications in
different fields related with optoelectronics, catalysis, gas sensing and photovoltaics [2]…

Applying Ultrashort Pulsed Direct Laser Interference Patterning for Functional Surfaces
 

Daniel Wyn Müller,Tobias Fox, Philipp G. Grützmacher, Sebastian Suarez & Frank Mücklich

Abstract

Surface structures in the micro- and nanometre length scale exert a major influence on performance and functionality for many specialized applications in surface engineering. However, they are often limited to certain pattern scales and materials, depending on which processing technique is used. Likewise, the morphology of the topography is in complex relation to the utilized processing methodology. In this study, the generation of hierarchical surface structures in the micro- as well as the sub-micrometre scale was achieved on ceramic, polymer and metallic materials by utilizing Ultrashort Pulsed Direct Laser Interference Patterning (USP-DLIP)…

L'affiche

PULSATEC
Application des technologies de traitement de surface par plasma pulsé sur des surfaces 3D complexes.
Coût du projet : 2 107 789€
Coût FEDER : 1 114 911€

Le flyer

Première plate-forme de collaboration transfrontalière de la Grande-Région dans le domaine des technologies de traitement de surface.