PUBLICATIONS

Scientific reports

Oxide semiconductors and related devices produced by high power impulse magnetron sputtering and selective area atomic layer deposition methods

Christy Fadel1, Stéphane Cuynet1, Claudia De Melo1, Marcos Soldera2,
Jean-François Pierson1, Frank Müklich3, David Horwat1

1. Institut Jean lamour, Nancy, France / 2. Institut für Fertigungstechnik, Dresden,Germany / 3. Lehrstuhl für Funktionswerkstoffe, Saarbrücken, Germany

Abstract

Zinc oxide (ZnO) and Al-doped ZnO (AZO) are widely used as n-type
semiconductors and transparent electrodes due to the abundance and low cost of Zn and Al in addition to their high optical and electrical properties. An important technique for depositing (AZO) films is the High Impulse Magnetron Sputtering (HiPIMS) method that allows us to deposit highly conductive and transparent films on large surfaces and at low temperatures [1]. Another important technique is the Atomic Layer Deposition (ALD) which is used for depositing high-quality films with excellent surface coverage on high aspect ratio structures; this method enables us to combine metallic Cu films with semiconductor oxides (ZnO, Cu2O, or both) leading to many applications in different fields related with optoelectronics, catalysis, gas sensing and photovoltaics [2]…

Applying Ultrashort Pulsed Direct Laser Interference Patterning for Functional Surfaces

Daniel Wyn Müller,Tobias Fox, Philipp G. Grützmacher, Sebastian Suarez & Frank Mücklich

Abstract

Surface structures in the micro- and nanometre length scale exert a major influence on performance and functionality for many specialized applications in surface engineering. However, they are often limited to certain pattern scales and materials, depending on which processing technique is used. Likewise, the morphology of the topography is in complex relation to the utilized processing methodology. In this study, the generation of hierarchical surface structures in the micro- as well as the sub-micrometre scale was achieved on ceramic, polymer and metallic materials by utilizing Ultrashort Pulsed Direct Laser Interference Patterning (USP-DLIP)…

The poster

PULSATEC
Application of pulsed plasma surface treatment technologies to complex 3D surfaces.
Project cost : 2 107 789€
ERDF cost : 1 114 911€

The flyer

First platform for cross-border collaboration in the Greater Region in the field of surface treatment technologies.